i ntegrated c ircuits d ivision www.ixysic.com ds-CPC1706-r04 1 CPC1706 single-pole, normally open 4-pin optomos ? dc power sip relay part # description CPC1706y 4-pin (8-pin body) power sip package (25 per tube) parameter rating units blocking voltage 60 v p load current 4 a dc on-resistance (max) 0.09 ? applications features description ordering information pin configuration ? industrial controls ? motor control ? robotics ? medical equipment?patient/equipment isolation ? instrumentation ? multiplexers ? data acquisition ? electronic switching ? i/o subsystems ? meters (watt-hour, water, gas) ? ic equipment ? home appliances ? handle load currents up to 4a dc ? 2500v rms input/output isolation ? power sip package ? high reliability ? low drive power requirements ? arc-free with no snubbing circuits ? no emi/rfi generation ? flammability rating ul 94 v-0 ixys integrated circuits division and ixys have combined to bring optomos ? technology, reliability, and compact size to a new family of high power solid state relays. the CPC1706, a dc-switching, normally open (1-form-a) solid state relay, is part of that family. employing optically coupled mosfet technology, the CPC1706 provides 2500v rms of input to output isolation. the relay output is constructed with efficient mosfet switches that use ixys integrated circuits division's patented optomos architecture. the input, a highly efficient infrared led, controls the optically coupled output. the combination of low on-resistance and high load current handling capability makes this relay suitable for a variety of high performance switching applications. switching characteristics of normally open devices approvals ? ul 508 certified component: file e69938 ? csa certified component: certificate 1172007 form-a i f i load 10% 90% t on t off
i ntegrated c ircuits d ivision www.ixysic.com 2 r04 CPC1706 absolute maximum ratings are stress ratings. stresses in excess of these ratings can cause permanent damage to the device. functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. typical values are characteristic of the device at +25c, and are the result of engineering evaluations. they are provided for information purposes only, and are not part of the manufacturing testing requirements. absolute maximum ratings @ 25oc parameter min max units blocking voltage - 60 v p reverse input voltage - 5 v input control current - 50 ma peak (10ms) - 1 a input power dissipation 1 - 150 mw total power dissipation 2 - 1600 mw isolation voltage, input to output - 2500 v rms operational temperature -40 +85 c storage temperature -40 +125 c 1 derate linearly 3.33 mw / oc 2 derate linearly 16.667 mw / oc parameter conditions symbol min typ max units output characteristics load current, continuous i f =5ma, free air i l --4a dc peak load current i f =5ma, t=10ms i lpk --9a on-resistance 1 i f =5ma, i l =1a r on - 0.07 0.09 ? off-state leakage current i f =0ma, v l =60v p i leak --1a switching speeds turn-on i f =5ma, v l =10v t on - 0.5 5 ms turn-off t off - 0.085 2 output capacitance i f =0ma, v l =50v, f=1mhz c out -75 -pf input characteristics input control current to activate i l =1a i f - 1.4 5 ma input control current to deactivate - i f 0.4 - - ma input voltage drop i f =5ma v f 0.9 1.2 1.4 v reverse input current v r =5v i r - - 10 a input/output characteristics capacitance input-to-output v io =0v, f=1mhz c io -2 -pf 1 measurement taken within 1 second of on-time. electrical characteristics @ 25oc (unless otherwise noted) parameter conditions symbol min typ max units thermal impedance (junction to case) - ? jc - 1.5 - c/w thermal characteristics
i ntegrated c ircuits d ivision CPC1706 www.ixysic.com 3 r04 * the performance data shown in the graphs above is typical of device performance. for guaranteed parameters not indicated in the written speci? cations, please contact our application department. led forward voltage (v) 1.235 1.240 1.245 1.250 1.255 1.260 1.265 device count (n) 0 5 10 15 20 25 30 typical led forward voltage drop (n=50, i f =5ma) turn-on time (ms) 0.290 0.375 0.460 0.545 0.630 0.715 0.800 device count (n) 0 5 10 15 20 25 typical turn-on time (n=50, i f =5ma, i l =75ma) turn-off time (ms) 0.075 0.080 0.085 0.090 0.095 0.100 0.105 device count (n) 0 5 10 15 20 typical turn-off time (n=50, i f =5ma, i l =75ma) led current (ma) 1.1 1.2 1.4 1.5 1.6 1.8 device count (n) 0 5 10 15 20 typical i f for switch operation (n=50, i l =1a) on-resistance ( : ) 0.058 0.062 0.066 0.070 0.074 0.078 0.082 device count (n) 0 5 10 15 20 typical on-resistance distribution (n=50, i f =5ma, i l =1a) blocking voltage (v p ) 81.0 81.5 82.0 82.5 83.0 83.5 84.0 device count (n) 0 5 10 15 20 typical blocking voltage distribution (n=50) temperature (oc) -40 -20 0 20 40 60 80 100 led forward current (ma) 1.3 1.4 1.5 1.6 1.7 1.8 typical i f for switch operation vs. temperature (i l =1a) temperature (oc) -40 -20 0 20 40 60 80 100 turn-on time ( p s) 200 250 300 350 400 450 500 550 600 650 typical turn-on vs. temperature (i l =75ma) i f =5ma i f =10ma temperature (oc) -40 -20 0 20 40 60 80 100 turn-off time ( p s) 70 80 90 100 110 120 130 typical turn-off vs. temperature (i l =75ma) i f =5ma i f =10ma temperature (oc) -40 -20 0 20 40 60 80 100 led forward voltage (v) 1.1 1.2 1.3 1.4 1.5 1.6 typical led forward voltage drop vs. temperature i f =50ma i f =20ma i f =10ma i f =5ma led forward current (ma) 0 1020304050 turn-on time ( p s) 0 200 400 600 800 1000 1200 typical turn-on vs. led forward current (i l =75ma) led forward current (ma) 0 1020304050 turn-off time ( p s) 85 90 95 100 105 typical turn-off vs. led forward current (i l =75ma) performance data @25 o c (unless otherwise noted)*
i ntegrated c ircuits d ivision www.ixysic.com 4 r04 CPC1706 * the performance data shown in the graphs above is typical of device performance. for guaranteed parameters not indicated in the written speci? cations, please contact our application department. temperature (oc) -40 -20 0 20 40 60 80 100 on-resistance ( : ) 0.05 0.06 0.07 0.08 0.09 0.10 dc-only on-resistance vs. temperature (i f =5ma, i l =1a) load voltage (v) 0.00 0.05 0.10 0.15 0.20 0.25 0.30 load current (a) 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 typical load current vs. load voltage (i f =5ma) temperature (oc) -40 -20 0 20 40 60 80 100 load current (a) 1.5 2.0 2.5 3.0 3.5 4.0 4.5 maximum load current vs. temperature temperature (oc) -40 -20 0 20 40 60 80 100 blocking voltage (v p ) 76 78 80 82 84 86 blocking voltage vs. temperature temperature (oc) -40 -20 0 20 40 60 80 100 leakage current (na) 0 10 20 30 40 50 60 70 typical leakage vs. temperature measured across pins 3 & 4 (v l =60v) load voltage (v) 0 102030405060 output capacitance (pf) 50 100 150 200 250 300 350 400 450 500 output capacitance vs. load voltage time 10 p s 100 p s 1ms 10ms 100ms 1s 10s 100s load current (a) 0 4 8 12 16 energy rating curve performance data @25 o c (unless otherwise noted)*
i ntegrated c ircuits d ivision CPC1706 www.ixysic.com 5 r04 manufacturing information moisture sensitivity all plastic encapsulated semiconductor packages are susceptible to moisture ingression. ixys integrated circuits division classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, ipc/jedec j-std-020, in force at the time of product evaluation. we test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. this product carries a moisture sensitivity level (msl) classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard ipc/jedec j-std-033. device moisture sensitivity level (msl) classi cation CPC1706y msl 1 esd sensitivity this product is esd sensitive , and should be handled according to the industry standard jesd-625 . soldering profile provided in the table below is the classification temperature (t c ) of this product and the maximum dwell time the body temperature of this device may be above (t c - 5)oc. the classification temperature sets the maximum body temperature allowed for this device during lead-free reflow processes. for through hole devices, and any other processes, the guidelines of j-std-020 must be observed. device classi cation temperature (t c ) dwell time (t p ) max re ow cycles CPC1706y 245oc 30 seconds 1 board wash ixys integrated circuits division recommends the use of no-clean flux formulations. board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. these precautions include, but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. additionally, the device must not be exposed to flux or solvents that are chlorine- or fluorine-based. cleaning methods that employ ultrasonic energy should not be used.
i ntegrated c ircuits d ivision ixys integrated circuits division makes no representations or warranties with respect to the accuracy or completeness of the co ntents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. neither circuit patent licenses nor indemnity a re expressed or implied. except as set forth in ixys integrated circuits division?s standard terms and conditions of sale, ixys integrated circuits division assumes no liability whatsoever, a nd disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringem ent of any intellectual property right. the products described in this document are not designed, intended, authorized or warranted for use as components in systems in tended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of ixys integrated circuits division?s product may resul t in direct physical harm, injury, or death to a person or severe property or environmental damage. ixys integrated circuits division reserves the right to discontinue or make changes to its p roducts at any time without notice. specification: ds-CPC1706-r04 ?copyright 2016, ixys integrated circuits division optomos ? is a registered trademark of ixys integrated circuits division all rights reserved. printed in usa. 5/4/2016 for additional information please visit our website at: www.ixysic.com 6 CPC1706 mechanical dimensions dimensions mm (inches) 1.150 dia. x4 (0.045 dia. x4) 2.540 (0.100) pin 1 10.160 (0.400) 5.080 (0.200) 1.75 (0.069) 10.1600.127 (0.4000.005) 21.0820.381 (0.8300.015) 4.5720.127 (0.1800.005) 1.0160.127 (0.0400.005) 10.1600.127 (0.4000.005) 1.778 (0.070) 5.0800.127 (0.2000.005) 2.5400.127 (0.1000.005) 0.7620.076 (0.0300.003) 1.6510.102 (0.0650.004) 7o typ 4 places 7o typ 4 places 3.3020.051 (0.1300.002) 0.3810.013 (0.0150.0005) 1.778 (0.070) pcb hole pattern pin 1 note: pin-to-pin tolerances are non-cumulative.
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